| PART |
Description |
Maker |
| BD63821EFV BD63821EFV12 BD63823EFV |
Moter Drivers for Printers Motor Drivers with Brush for Printers
|
Rohm
|
| RLD78NZC3 |
Laser Diodes > For Laser Printers, Sensoers > For Laser Printers
|
ROHM
|
| AM29DL323DB90WDIN AM29DL323DB120WDI AM29DL323DB120 |
500V Single N-Channel Hi-Rel MOSFET in a TO-204AA package; A IRF450 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A JANTX2N7228 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a 18-pin LCC package; A IRFE430 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a 18-pin LCC package; A JANTX2N6802U with Standard Packaging
12V Single N-Channel Hi-Rel MOSFET in a SMD-0.5 package; A IRL7NJ3802 with Standard Packaging
60V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY044CM with Standard Packaging
100V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A IRFM140 with Standard Packaging
-20V Single P-Channel Hi-Rel MOSFET in a SMD-0.5 package; A IRL5NJ7404 with Standard Packaging
150V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A IRF5M3415 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a SMD-1 package; A JANTXV2N7222U with Standard Packaging
100V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A JANTXV2N7218 with Standard Packaging
200V Single N-Channel Hi-Rel MOSFET in a TO-254AA package; A IRFM260 with Standard Packaging
AME270461; A AME270461 with Standard Packaging x8/x16闪存EEPROM
AFC461; Qualified Part Number similar to AFC461 x8/x16闪存EEPROM
AME28461; A AME28461 with Standard Packaging x8/x16闪存EEPROM
x8/x16 Flash EEPROM x8/x16闪存EEPROM
100V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A JANTXV2N6764 with Standard Packaging x8/x16闪存EEPROM
IR2113L6; A IR2113L6 with Standard Packaging x8/x16闪存EEPROM
-55V Single P-Channel Hi-Rel MOSFET in a TO-254AA package; A IRF5M4905 with Standard Packaging x8/x16闪存EEPROM
|
Spansion, Inc.
|
| AM29818AXM AM29818ADE AM29818APC AM29818ADCB AM298 |
Digital Audio Driver with Discrete Dead-Time and Protection. High and Low Side Driver in a 14-Lead SOIC package; A IRS20124S packaged in a Lead-Free
Pipeline Register
High Performance Appliance RAM Based Motion Control IC; A IRMCF343 with Standard Packaging
High Voltage, high performance Class D audio aplifier driver with PWM modulator and protection in a 16-Lead PDIP Package; A IRS2092PBF with Standard Packaging
Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to IP2003ATR with Lead Free Packaging.
High Voltage, high performance Class D audio aplifier driver with PWM modulator and protection in a 16-Lead SOIC Narrow Package; Similar to IRS2092PBF Shipped on Tape and Reel
Synchronous Buck Multiphase Optimized BGA Power Block.; Similar to iP2002 with Lead Free Packaging on Tape and Reel.
500VA HiRel iMotion Digital Sensor-Less Motor Controller in an MP-3T package.; A IRMCT3UF1 with Standard Packaging
Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to IP2003A with Lead Free Packaging.
A high performance OTP based motion control IC designed primarily for appliance applications.; A IRMCK343 with Standard Packaging
Self-Oscillating Full-Bridge 600V Driver in a 14-Lead SOIC narrow boddy package; A IRS2453D packaged in a Lead-Free 14-Lead SOIC shipped on Tape and Reel
Protected Digital Audio Driver with Floating PWM input in a 16-Lead SOIC Narrow Package; A IRS20955SPBF packaged in a Lead-Free 16-Lead SOIC Narrow shipped on Tape and Reel
IP1001; A IP1001 with Standard Packaging
Dual Output Full Function 2 Phase Synchronous Power Block, Integrated Power Semiconductors, PWM Controller and Passives.; Similar to iP1201 with Lead Free packaging.
Protected Digital Audio Driver with Floating PWM input; A IRS20954SPBF with Standard Packaging 管道注册
|
Advanced Micro Devices, Inc.
|
| PL342 PL34120191000GDDC PL34120191000KKEX PL341201 |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
|
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
| AM29845AJC AM29845A/BLA AM29845ADMB AM29845APC AM2 |
600V UltraFast 8-25 kHz Discrete IGBT in a TO-220AB package; A IRG4BC30K with Standard Packaging
1200V UltraFast 4-20 kHz Discrete IGBT in a TO-247AC package; A IRG4PH50K with Standard Packaging
600V UltraFast 8-60 kHz Discrete IGBT in a TO-247AC package; A IRG4PC40U with Standard Packaging
600V UltraFast 8-25 kHz Discrete IGBT in a TO-247AC package; Similar to IRG4PC40K with Lead Free Packaging
1200V UltraFast 8-25 kHz Single IGBT in a TO-274AA package; A IRGPS40B120U with Standard Packaging
600V UltraFast 8-60 kHz Discrete IGBT in a TO-247AC package; A IRG4PC50U with Standard Packaging
1200V UltraFast 8-40 kHz Discrete IGBT in a TO-274AA package; A IRG4PSH71U with Standard Packaging
1200V UltraFast 4-20 kHz Discrete IGBT in a D2-Pak package; A IRG4BH20K-S with Standard Packaging
600V Fast 1-8 kHz Discrete IGBT in a TO-247AC package; A IRG4PC50F with Standard Packaging
1200V UltraFast 5-40 kHz Discrete IGBT in a TO-247AC package; A IRG4PH50U with Standard Packaging
10-Bit D-Type Latch
600V Warp 60-150 kHz Discrete IGBT in a TO-262 package; A IRG4BC40WL with Standard Packaging 8位D型锁存器
8-Bit D-Type Latch 8位D型锁存器
|
Bourns, Inc.
|
| GL35-00 GL35-01 GL35-02 GL35-04 GL35-06 GL35-08 GL |
Aluminum Electrolytic Radial Lead Low Impedance High Reliability Capacitor; Capacitance: 120uF; Voltage: 6.3V; Case Size: 6.3x7 mm; Packaging: Bulk 在行高硅桥式整流器电流（电压- 5000伏特电流- 155安培
IN-LINE HIGH CURRENT SILICON BRIDGE RECTIFIERS(VOLTAGE - 50 to 800 Volts CURRENT - 15 to 35 Amperes) 在行高硅桥式整流器电流（电压- 5000伏特电流- 1535安培
IN-LINE HIGH CURRENT SILICON BRIDGE RECTIFIERS(VOLTAGE - 50 to 800 Volts CURRENT - 15 to 35 Amperes) 在行高硅桥式整流器电流（电压- 5000伏特电流- 155安培
Aluminum Electrolytic Radial Lead Low Impedance High Reliability Capacitor; Capacitance: 22uF; Voltage: 6.3V; Case Size: 5x11 mm; Packaging: Bulk
Aluminum Electrolytic Radial Lead Low Impedance High Reliability Capacitor; Capacitance: 68uF; Voltage: 6.3V; Case Size: 4x11 mm; Packaging: Bulk
Aluminum Electrolytic Radial Lead Low Impedance High Reliability Capacitor; Capacitance: 56uF; Voltage: 6.3V; Case Size: 5x7 mm; Packaging: Bulk
XTAL CER SMT 6X3.5 2PAD
Aluminum Electrolytic Radial Lead Low Impedance High Reliability Capacitor; Capacitance: 1200uF; Voltage: 6.3V; Case Size: 8x20 mm; Packaging: Bulk
LED Panel Indicator; LED Color:Yellow; Luminous Intensity:40foot lambert; Forward Current:8.5mA; Forward Voltage:125V; Operating Temperature Range:-25 C to 85 C; Color:Yellow; Leaded Process Compatible:No RoHS Compliant: No
|
Transys Electronics, Ltd.
Transys Electronics Ltd.
TRSYS
|
| AM29F400AB-150FEB AM29F400AT-150FE AM29F400AT-150S |
55V Single N-Channel HEXFET Power MOSFET in a D2Pak Package; A IRF3205ZS with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFB3307 with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; A IRF1010ZL with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF1010Z with Standard Packaging
30V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF3707 with Standard Packaging
x8/x16 Flash EEPROM
75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to IRF1407 with Lead Free Packaging
100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRLU120N with Standard Packaging x8/x16闪存EEPROM
|
Advanced Micro Devices, Inc.
|
| QUATRO4050 |
Programmable SOC Solution for Printers and All-in-Ones
|
ZORAN[Zoran Corporation]
|
| TLP833F TLP83307 |
Copiers, Printers, Fax Machines
|
Toshiba Semiconductor
|
| KD3002-DC92A |
Thermal Printheads / for Ticket or Scale Printers
|
ROHM
|
| KD3006-DC72A |
Thermal Printheads / for Ticket or Scale Printers
|
ROHM
|
